7025015787945 | 5985014980332 |
5985013243461 | 1510000808414 |
7025015588807 | 7010015006979 |
5905000000136 | 6135014938794 |
7025014906701 | 6150012089751 |
View All |
If you are in need of parts such as Microcircuit Memory from Raytheon Company, look no further than ASAP Inventory. As a wholly-owned subsidiary of ASAP Semiconductor, we have access to an inventory of more than two billion new and obsolete parts and components such as ROM PROM FAMILY 008 and many more. ASAP Inventory is an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited business, and the only independent distributor with a strict No China Sourcing Pledge, guaranteeing that each part you purchase from us is fully traceable or comes directly from the manufacturer. Anything not in our inventory can be tracked down and shipped to you with short lead times and competitive prices through our vast and diverse international supply chain network that spans North America and Europe.
Our website offers parametric search capabilities allowing our customers to search for parts through a number of filters, one of which is by National Stock Number, or NSN. A National Stock Number is an identifier applied to any item of supply that is repeatedly procured, stocked, stored, issued, and used throughout the federal supply system. ASAP Inventory has a broad selection of NSN parts such as 5962012014041 from manufacturers like Raytheon Company. To begin the purchasing process immediately, submit an RFQ today.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-201-4041 Item Description: Microcircuit Memory | 5962 | 012014041 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Rom Prom Family 008 | 2 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAU | BODY HEIGHT | 0.185 INCHES NOMINAL |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 794.0 MILLIWATTS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND SCHOTTKY AND 3-STATE OUTPUT AND HIGH IMPEDANCE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
CZER | MEMORY DEVICE TYPE | PROM |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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